40 C.F.R. § 98 app Table I-5 to Subpart I of Part 98

Current through May 31, 2024
Appendix Table I-5 to Subpart I of Part 98 - Default Emission Factors (1-U[ij]) for Gas Utilization Rates (U[ij]) and By-Product Formation Rates (B[ijk]) for MEMS Manufacturing

Process type factorsProcess gas i
CF4 C2F6 CHF3 CH2F2 C3F8c- C4F8 NF3
Remote
NF3 SF6 C4F6a C5F8a C4F8Oa
Etch 1-Ui0.710.410.410.06NA10.2NA0.20.20.10.2NA
Etch BCF4NA10.410.0710.08NA0.2NANANA10.30.2NA
Etch BC2F6NANANANANA0.2NANANA10.20.2NA
CVD Chamber Cleaning 1-Ui0.90.6NANA0.40.10.020.2NANA0.10.1
CVD Chamber Cleaning BCF4NA0.1NANA0.10.120.0220.1NANA0.10.1
CVD Chamber Cleaning BC3F8NANANANANANANANANANANA0.4

Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

1 Estimate includes multi-gas etch processes.

2 Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive.

40 C.F.R. 98 app Table I-5 to Subpart I of Part 98

75 FR 74818, Dec. 1, 2010, as amended at 78 FR 68225, Nov. 13, 2013