Subpart I - ELECTRONICS MANUFACTURING

Appendix Table I-1 to Subpart I of Part 98 - Default Emission Factors for Threshold Applicability Determination
Appendix Table I-2 to Subpart I of Part 98 - Examples of Fluorinated GHGs Used by the Electronics Industry
Appendix Table I-3 to Subpart I of Part 98 - Default Emission Factors (1-U[ij]) for Gas Utilization Rates (U[ij]) and By-Product Formation Rates (B[ijk]) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes
Appendix Table I-4 to Subpart I of Part 98 - Default Emission Factors (1-U[ij]) for Gas Utilization Rates (U[ij]) and By-Product Formation Rates (B[ijk]) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size
Appendix Table I-5 to Subpart I of Part 98 - Default Emission Factors (1-U[ij]) for Gas Utilization Rates (U[ij]) and By-Product Formation Rates (B[ijk]) for MEMS Manufacturing
Appendix Table I-6 to Subpart I of Part 98 - Default Emission Factors (1-U[ij]) for Gas Utilization Rates (U[ij]) and By-Product Formation Rates (B[ijk]) for LCD Manufacturing
Appendix Table I-7 To Subpart I of Part 98 - Default Emission Factors (1-U[ij]) for Gas Utilization Rates (U[ij]) and By-Product Formation Rates (B[ijk]) for PV Manufacturing
Appendix Table I-8 to Subpart I of Part 98 - Default Emission Factors (1-U[N2O,j]) for N[2]O Utilization (U[N2O,j])
Appendix Table I-9 to Subpart I of Part 98 - Methods and Procedures for Conducting Emissions Test for Stack Systems
Appendix Table I-10 to Subpart I of Part 98 - Maximum Field Detection Limits Applicable to Fluorinated GHG Concentration Measurements for Stack Systems
Appendix Table I-11 to Subpart I of Part 98 - Default Emission Factors (1-U[ij]) for Gas Utilization Rates (U[ij]) and By-Product Formation Rates (B[ijk]) for Semiconductor Manufacturing for Use With the Stack Test Method (150 mm and 200 mm Wafers)
Appendix Table I-12 to Subpart I of Part 98 - Default Emission Factors (1-U[ij]) for Gas Utilization Rates (U[ij]) and By-Product Formation Rates (B[ijk]) for Semiconductor Manufacturing for Use With the Stack Test Method (300 mm and 450 mm Wafers)
Appendix Table I-13 to Subpart I of Part 98 - Default Emission Factors (1-U[ij]) for Gas Utilization Rates (U[ij]) and By-Product Formation Rates (B[ijk]) for LCD Manufacturing for Use With the Stack Test Method
Appendix Table I-14 to Subpart I of Part 98 - Default Emission Factors (1-U[ij]) for Gas Utilization Rates (U[ij]) and By-Product Formation Rates (B[ijk]) for PV Manufacturing for Use With the Stack Test Method
Appendix Table I-15 to Subpart I of Part 98 - Default Emission Factors (1-U[ij]) for Gas Utilization Rates (U[ij]) and By-Product Formation Rates (B[ijk]) for MEMS Manufacturing for Use With the Stack Test Method
Appendix Table I-16 to Subpart I of Part 98 - Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing
Appendix Table I-17 to Subpart I of Part 98 - Expected and Possible By-Products for Electronics Manufacturinglg
Appendix A to Subpart I of Part 98 - Alternative Procedures for Measuring Point-of-Use Abatement Device Destruction or Removal Efficiency
Section 98.90 - Definition of the source category
Section 98.91 - Reporting threshold
Section 98.92 - GHGs to report
Section 98.93 - Calculating GHG emissions
Section 98.94 - Monitoring and QA/QC requirements
Section 98.95 - Procedures for estimating missing data
Section 98.96 - Data reporting requirements
Section 98.97 - Records that must be retained
Section 98.98 - Definitions