Current with legislation from the 2023 Regular and Special Sessions signed by the Governor as of November 21, 2023.
Section 51.408 - Issuance of Bonds(a) After a district is created and has adopted plans for construction of a plant and improvements, it may issue bonds to pay for constructing the plant and improvements and to pay costs and charges incident to the construction including the cost of necessary property and the retirement of preliminary bonds.(b) The maximum amount of bonds which may be issued may not be more than the amount of the engineer's estimate plus the additional amounts added by the board in the election order. Acts 1971, 62nd Leg., p. 336, ch. 58, Sec. 1, eff. 8/30/1971.