Texas Instruments IncorporatedDownload PDFPatent Trials and Appeals BoardMay 6, 20202019004266 (P.T.A.B. May. 6, 2020) Copy Citation UNITED STATES PATENT AND TRADEMARK OFFICE UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www.uspto.gov APPLICATION NO. FILING DATE FIRST NAMED INVENTOR ATTORNEY DOCKET NO. CONFIRMATION NO. 15/138,298 04/26/2016 Lee Han Meng@ Eugene Lee TI-72549A.1 8505 23494 7590 05/06/2020 TEXAS INSTRUMENTS INCORPORATED P O BOX 655474, MS 3999 DALLAS, TX 75265 EXAMINER GARCES, NELSON Y ART UNIT PAPER NUMBER 2814 NOTIFICATION DATE DELIVERY MODE 05/06/2020 ELECTRONIC Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the following e-mail address(es): uspto@ti.com PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD Ex parte LEE EUGENE LEE, and YOU CHYE HOW Appeal 2019-004266 Application 15/138,298 Technology Center 2800 Before LINDA M. GAUDETTE, JAMES C. HOUSEL, and BRIAN D. RANGE, Administrative Patent Judges. GAUDETTE, Administrative Patent Judge. DECISION ON APPEAL1 The Appellant2 appeals under 35 U.S.C. § 134(a) from the Examiner’s decision finally rejecting claims 32, 33, 35, 36 and 38–48.3 We REVERSE. 1 This Decision includes citations to the following documents: Specification filed April 26, 2016 (“Spec.”); Final Office Action dated June 14, 2018 (“Final”); Appeal Brief filed Dec. 14, 2018 (“Appeal Br.”); Examiner’s Answer dated Mar. 8, 2019 (“Ans.”); and Reply Brief filed May 8, 2019 (“Reply Br.”). 2 We use the word “Appellant” to refer to “applicant” as defined in 37 C.F.R. § 1.42. The Appellant identifies the real party in interest as Texas Instruments Incorporated. Appeal Br. 3. 3 We have jurisdiction under 35 U.S.C. § 6(b). Appeal 2019-004266 Application 15/138,298 2 CLAIMED SUBJECT MATTER Claim 32, reproduced below, is illustrative of the claimed subject matter: 32. A method for forming a semiconductor package, the method comprising: attaching a semiconductor die to a leadframe, wherein the leadframe is made by: etching a conductive sheet from a first side to form a first region; etching the conductive sheet from the first side to form a second region, the first region thinner than the second region; and etching the conductive sheet from an opposite second side, wherein etching the conductive sheet from an opposite second side creates a plurality of lead lines between a plurality of bond pads; electrically connecting the semiconductor die to the leadframe; and molding portions of the semiconductor die and the leadframe using molding compound. Appeal Br. 9, Claims Appendix (emphasis added). REJECTIONS 1. Claims 32, 33, 35, 36, 38, 39, and 42–46 are rejected under 35 U.S.C. § 102(a)(1) as anticipated by Bayan (US 6,674,156 B1, issued Jan. 6, 2004). 2. Claims 40, 41, 47 and 48 are rejected under 35 U.S.C. § 103 as unpatentable over Bayan. Appeal 2019-004266 Application 15/138,298 3 OPINION Independent claim 32 and independent claim 43 recite “[a] method for forming a semiconductor package, . . . wherein the leadframe is made by: etching a conductive sheet from a first side to form a first region; [and] etching the conductive sheet from the first side to form a second region, the first region thinner than the second region.” Appeal Br. 9–11, Claims Appendix. The Examiner cited Bayan column 3, lines 11–15, for a teaching of etching to form first and second regions having different thicknesses. Final 3. In column 3, lines 11–15, Bayan discloses a method that includes “partially etching a top surface of a substrate panel to form recessed regions that define a portion of a first and a second set of tie bars and a portion of a first and second set of contact pads.” The Appellant argues that the claim 32 and claim 43 etching limitations do not read on Bayan’s partial etching step because the claims require etching twice on the first side—etching a first region to a first depth and etching a second region to a second depth that differs from the first depth—whereas Bayan etches only once on the first side to a first depth. Appeal Br. 5. The Examiner disagrees, contending that “the claim language does not specify that the etching is performed in two separate steps, it simply requires etching.” Ans. 4 (quoting the Advisory Action dated Sept. 10, 2018). The respective positions of the Appellant and the Examiner raise a claim interpretation issue. During examination, claim terms are given their broadest reasonable construction consistent with the Specification. In re ICON Health & Fitness, Inc., 496 F.3d 1374, 1379 (Fed. Cir. 2007). Appeal 2019-004266 Application 15/138,298 4 The correct inquiry in giving a claim term its broadest reasonable interpretation in light of the specification is not whether the specification proscribes or precludes some broad reading of the claim term adopted by the examiner. And it is not simply an interpretation that is not inconsistent with the specification. It is an interpretation that corresponds with what and how the inventor describes his invention in the specification, i.e. an interpretation that is consistent with the specification. In re Smith Int’l, Inc., 871 F.3d 1375, 1382–83 (Fed. Cir. 2017) (internal quotation omitted). “[A]lthough a method claim necessarily recites the steps of the method in a particular order, as a general rule the claim is not limited to performance of the steps in the order recited, unless the claim explicitly or implicitly requires a specific order.” Baldwin Graphic Sys, Inc. v. Siebert, Inc., 512 F.3d 1338, 1345 (Fed. Cir. 2008); see also In re Gleizer, 356 Fed. Appx. 415, 419 (Fed. Cir. Dec. 15, 2009) (non-precedential) (“[U]nless the steps of a method actually recite or implicitly necessitate a specific order, the steps are not ordinarily construed to require one.” (citing Interactive Gift Express, Inc. v. CompuServe Inc., 256 F.3d 1323, 1342–43 (Fed. Cir. 2001)). Turning first to the language of independent claims 32 and 43, we note that etching of the conductive sheet’s first side is recited as two, separate steps—one step for forming a first region, and a second step for forming a second region having a thickness greater than that of the first region. Appeal Br. 9–11, Claims Appendix. We find no independent or dependent claim language that explicitly or implicitly requires a specific order of the first two etching steps. See id. Nor does the claim language, considered without reference to the written description, preclude simultaneously performing the first two etching steps on the conductive Appeal 2019-004266 Application 15/138,298 5 sheet’s first side to form both a first region and second region having different depths. Turning next to the written description, we find the following disclosure relating to etching of a conductive sheet to form a leadframe: “Leadframe 200 may be fabricated by a double etch process. A first etch step 261 removes a portion of the leadframe material to form the bottom half of lead lines 230–232. A second etch step 262 then removes a portion of the leadframe material to form the top half of the lead lines and to define the bond pads.” Spec. ¶ 20. The Specification also describes a triple etch process. In the triple etch process, “a first etched pattern” is formed as follows: “first etch mask 410 is applied to sheet 400 . . . . Once the first mask 410 is in place, exposed regions such as 412, 413 of copper sheet 400 are etched away . . . . The etch process is allowed to proceed to a depth E1 . . . [that] is less than the thickness of sheet 400.” Id. ¶ 27. “[A] second etched pattern” is formed by applying second etch mask 420 that may cover previously etched regions. Id. ¶ 28. “Once the second mask 420 is in place, exposed regions such as 424 of copper sheet 400 are etched away . . . . The etch process is allowed to proceed to a depth E2 . . . [that] is less than depth E1.” Id. ¶ 29. Third mask 430 is then applied to a back side of sheet 400 and a third etch pattern is formed in a similar manner by etching to a depth E3. Id. ¶ 30. The Specification discloses that “the order of etching may be different. For example, mask 420 may be applied first and etching performed to depth E2, followed by application of mask 410 and etching performed to depth E1.” Id. ¶ 33. “In another example, mask 430 may be applied to the bottom side of copper sheet 400 while mask 410 or 420 is applied to the top Appeal 2019-004266 Application 15/138,298 6 side of copper sheet 400 and then both sides may be etched in a single operation.” Id. Having reviewed the claim language in light of the Specification, we determine that the claims encompass performing the first two etching steps simultaneously. However, we do not interpret the claims in the manner proposed by the Examiner— i.e., to broadly encompass etching to a single depth, resulting in a first (etched) region and a second (unetched) region (see, e.g., Ans. 4–5)—as such interpretation would render either the first or the second etching step effectively meaningless. In other words, under the Examiner’s interpretation the first and second etching steps would achieve the same end result—a single etched region (or multiple regions etched to the same depth) on the conductive sheet’s first side, and a single (or multiple) unetched regions. See Cat Tech LLC v. TubeMaster, Inc., 528 F.3d 871, 885 (Fed. Cir. 2008) (refusing to adopt a construction that would render a claim limitation meaningless); In re Danly, 263 F.2d 844, 847 (CCPA 1959) (“While it may be literally true that any piece of wire could be used to perform that function, we are of the opinion that the quoted expression, taken in context, limits the claims to a construction in which a connection with a source of alternating current is actually made, since any other interpretation would render the quoted expression virtually meaningless.”). We agree with the Appellant that the claims require etching both the first region and the second region on the conductive sheet’s first side, such that the first and second regions have different depths, both thinner than the conductive sheet’s unetched thickness. Because the Examiner’s rejections are based on the Examiner’s finding that the claims read on Bayan’s method which etches only a single Appeal 2019-004266 Application 15/138,298 7 region (or regions) to a single depth on a conductive sheet’s first side (see Final 3; Bayan 3:11–15), we do not sustain the rejection of independent claims 32 and 43 or the rejections of the dependent claims. DECISION SUMMARY Claims Rejected 35 U.S.C. § Reference(s)/Basis Affirmed Reversed 32, 33, 35, 36, 38, 39, 42–46 102(a)(1) Bayan 32, 33, 35, 36, 38, 39, 42–46 40, 41, 47, 48 103 Bayan 40, 41, 47, 48 Overall Outcome: 32, 33, 35, 36, 38–48 REVERSED Copy with citationCopy as parenthetical citation