Ex Parte Seabaugh et alDownload PDFPatent Trial and Appeal BoardAug 14, 201714212310 (P.T.A.B. Aug. 14, 2017) Copy Citation United States Patent and Trademark Office UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O.Box 1450 Alexandria, Virginia 22313-1450 www.uspto.gov APPLICATION NO. FILING DATE FIRST NAMED INVENTOR ATTORNEY DOCKET NO. CONFIRMATION NO. 14/212,310 03/14/2014 Alan Seabaugh 135404.UND13007US2-P1407 9948 34018 7590 08/16/2017 Greenberg Traurig, LLP 77 W. Wacker Drive Suite 3100 CHICAGO, IL 60601-1732 EXAMINER TRAN, TONY ART UNIT PAPER NUMBER 2894 NOTIFICATION DATE DELIVERY MODE 08/16/2017 ELECTRONIC Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the following e-mail address(es): chiipmail @ gtlaw .com escobedot@gtlaw.com j arosikg @ gtlaw .com PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD Ex parte ALAN SEABAUGH1 and Susan Fullerton Appeal 2017-001102 Application 14/212,310 Technology Center 2800 Before MARKNAGUMO, JEFFREY R. ROBERTSON, and MICHAEL G. McMANUS, Administrative Patent Judges. NAGUMO, Administrative Patent Judge. DECISION ON APPEAL The University of Notre Dame du Lac (“Notre Dame”) timely appeals under 35 U.S.C. § 134(a) from the Final Rejection2 of all pending claims 1- 20. We have jurisdiction. 35 U.S.C. § 6. We reverse for reasons well-stated by Notre Dame. 1 The applicant under 37 C.F.R. § 1.46, and hence the appellant under 35 U.S.C. § 134, is the real party in interest, identified as the University of Notre Dame du Lac (“Notre Dame”). (Appeal Brief, filed 8 March 2016 (“Br.”), 1.) 2 Office Action mailed 15 September 2015 (“Final Rejection”; cited as “FR”). Appeal 2017-001102 Application 14/212,310 OPINION A. Introduction3 The subject matter on appeal relates to nonvolatile memory, i.e., memory that “retains stored data even when power is not supplied to the memory.” (Spec. 1 [0003].) According to the’310 Specification, existing nonvolatile memories, such as flash drives based on stacked gate structures, are limited by relatively low write speed and write/erase degradation. {Id.) Other technologies, such as resistive random access memory (“RRAM”) are also said to need improvements in writing speed. {Id. at 2-3 [0004].) The claimed invention, a “random access memory [“RAM”] cell formed by a transistor incorporating ion storage and a two dimensional crystal” (Spec. 1 [0002]), is said to provide high density nonvolatile data storage and high speed reading and writing. The two-dimensional crystal,4 which can be graphene, forms a conductive channel beneath the top gate of the transistor. The Specification reveals that high charge carrier densities can be formed in the two-dimensional crystal by charges proximate to the channel, and thus the conductivity of the channel can be modulated by varying the distance of mobile ions to the channel. {Id. at 4 [0012]-5 [0014].) This is done by adjusting the voltage on the back gate of the transistor. An embodiment of 3 Application 14/212,310, Single transistor random access memory using ion storage in two-dimensional crystals, filed 14 March 2014, claiming the benefit of a provisional application filed 15 March 2013. We refer to the “’310 Specification,” which we cite as “Spec.” 4 The Specification defines two-dimensional crystals as crystals that are “one monolayer thick so that electron transport in the out-of-plane direction is obstructed.” {Id. at 7-8 [0018].) 2 Appeal 2017-001102 Application 14/212,310 such a single-transistor RAM cell is illustrated in Specification Figures 1-3, which are reproduced below. FIG. 2 FIG. 3 {Fig. 1 shows an equivalent circuit of a single-transistor RAM} {Fig. 2 shows the transistor in the ON-state (conductive)} {Fig. 3 shows the transistor in the OFF-state (non-conductive)} The single transistor RAM cell 1405 6comprises bit line 102, which the Specification describes as being connected to drain 110 of the transistor [sic: source 142[6], word line 104 connected to top gate 112, write line 106 connected to back gate 146, and common connection 110 connected to source 142 [sic: drain 110]. (Spec. 5 [0014].) Source 142 is connected to drain 110 via 2D crystal channel 108, which may be graphene. {Id. at 7- 5 Throughout this Opinion, for clarity, labels to elements are presented in bold font, regardless of their presentation in the original document. 6 The circuit diagram 100 in Figure 1 does not label the source or drain of the transistor, and the description (Spec. 5 [0014]) uses the label 110 for both the drain and the common connection. It does not appear that these discrepancies would confuse a person having ordinary skill in the art. For simplicity, we assume, without deciding, that the circuit diagram 100 in Figure 1 has the same orientation as Figures 2 and 3. In the words of the Specification, “[a]s those having ordinary skill in the art will also understand, some of these statements must be taken in context.” {Id.) 3 Appeal 2017-001102 Application 14/212,310 8 [0018].) Top gate 112 is electrically isolated from channel 108 by dielectric layer 144. {Id. at 6-7 [0016].) Write line 106 may be used to change the state of channel 108 by moving ions 148 from one side of electrically insulating but ion-conducting solid electrolyte 150 to the other side. {Id. at 10 [0023]—11 [0025].) Ionic conductor 150 is described as a thin film for small-scale applications. {Id. at 11 [0026].) When ions 148 (e.g., lithium ions (Li+), and perchlorate (CKAf) drift through ion conductor 150 to the graphene interface at channel 108, an electric double layer is formed, which is said to induce sheet carrier densities in graphene channel 108 as high as about 4 x 1014/cm2 for both electrons and holes. In the words of the Specification, “[i]n effect, the resistance of the channel 108 is low when the lithium ions are drifted towards the graphene channel 108” {Id. at 9 [0021], penultimate sentence), as shown in Figure 2. This condition is generated when a positive voltage is applied to write line 106, and thus to back gate 146. {Id. at 10 [0023].) The positive lithium ions 148 are said to induce electrons from the source associated with bit line 102 into transistor channel 108 “without exchanging electrons, i.e., without oxidizing or reducing, due to the absence of dangling bonds in the 2D conductor.” {Id.) “Moreover, the close proximity of the ions 148 and induced charge carriers results in a Coulomb force that holds the ions 148 in place and provides non-volatility.” {Id.) “Conversely,” the Specification teaches, “the resistance of the channel 108 is high when the lithium ions are drifted away from the graphene channel 108” {id. at 9 [0021], last sentence), as shown in Figure 3. In the words of the Specification, “[depending on the thickness of the ion conductor and effective velocity of the positive lithium ions 148, the 4 Appeal 2017-001102 Application 14/212,310 speed of the single-transistor RAM cell for reading and writing is in the nanosecond range.” {Id. at 11 [0025].) Claim 1 is representative and reads: A single-transistor random access memory (RAM) cell comprising: a conductive path that transmits charge carriers from a source; a drain for receiving at least some of the charge carriers; a channel comprising a two-dimensional (2D) crystal the channel interposed between the source and the drain, wherein the charge carriers flow along the conductive path, through the channel, to the drain; a first gate for electrically regulating the flow of the charge carriers through the channel; a dielectric isolating the first gate from the channel; an electrically-insulating ion conductor interposed between the channel and a back gate, the conductor comprising a plurality of ions, which are mobile within the conductor, the back gate for selectively positioning the plurality of ions adjacent to the channel by creating an electric field that directs the plurality of ions, wherein the plurality of ions, when positioned adjacent to the channel, induce the charge carriers into the channel, and wherein Coulomb forces between the charge carriers in the channel and the plurality of ions positioned adjacent to the channel hold the plurality of ions adjacent to the channel. (Claims App., Br. 14; some indentation, paragraphing, and emphasis added.) 5 Appeal 2017-001102 Application 14/212,310 The Examiner maintains the following grounds of rejection7,8: A. Claims 1—4, 6-13, 15, 18, and 19 stand rejected under 35 U.S.C. § 102(b) in view of Oezyilmaz.9 Al. Claims 5, 14, 16, 17, and 20 stand rejected under 35 U.S.C. § 103(a) in view of Oezyilmaz. B. Discussion The Board’s findings of fact throughout this Opinion are supported by a preponderance of the evidence of record. The Examiner finds that Oezyilmaz Figures 1A and 7B10 reproduced on the following page, teach a single transistor RAM cell 10 meeting all the limitations of claim 1. (FR 2-3.) Oezyilmaz describes a memory cell 10 comprising a graphene layer 16 arranged on a dielectric layer 14 and encapsulated by a thin film ferroelectric layer 18. (Oezyilmaz 3 [0044].) Graphene layer 16 is electrically coupled to source region 15 and drain region 17. {Id.) Two alternative gate regions are formed. One by top electrode 20, which is coupled to ferroelectric layer 18, and the other by bottom electrode 12, which is coupled to dielectric layer 14. {Id.) 1 Examiner’s Answer mailed 23 August 2016 (“Ans.”). 8 Because this application claims the benefit of a provisional application filed before the 16 March 2013, effective date of the America Invents Act, we refer to the pre-AIA version of the statute. 9 Barbaras Oezyilmaz et al., Graphene memory cell and fabrication methods thereof U.S. Patent Application Publication 2011/0170330 Al (2011). 10 The Examiner cites Figure 7A, but reproduces and discusses Figure 7B. 6 Appeal 2017-001102 Application 14/212,310 {Oezyilmaz Figures IB and 7A are shown below} 10 Vw: -I- {Figure 1A shows a diagram of a memory cell in cross section} {Fig. 7A shows a memory cell with charged dielectric layer 14} Oezyilmaz explains that “[depending on the electric field established by the gating voltage, charge carriers in graphene can be tuned continuously from holes to electrons.” {Id. at [0045].) Thus, the charge carrier concentration as well as the conductivity can be controlled depending on the bias voltage applied at the gate. {Id.) In order to retain the different resistance states when the external field is switched off, Oezyilmaz “utilizes the remnant field of a ferroelectric layer to set a particular resistance state of the graphene layer.” {Id. at [0046], last sentence.) The Examiner finds that dielectric layer 14 comprises a plurality of ions, as shown in Figure 7B, that are interposed between graphene channel 16 and back gate 12. (FR 3.) However, as Notre Dame argues (Br. 7), there is no credible evidence in Oezyilmaz teaching or suggesting that dielectric layer 14 is an ionic 7 Appeal 2017-001102 Application 14/212,310 conductor. Rather, as Notre Dame urges, the weight of the evidence is that charge migration in dielectric layer 14 arises purely from the motion of electrons. {Id.) In contrast, the ’310 Specification characterizes the ion conductor as a solid electrolyte, such as a solid polymer electrolyte (Spec. 6- 7 [0016]; 9 [0021), or a 2D crown ether electrolyte with high ionic conductivity and low electronic conductivity {id. at 11 [0026]). The Examiner has not directed our attention to any indication that some broader meaning is intended that might encompass dielectrics such as the perovskite oxide disclosed by Oezyilmaz (Oezyilmaz 4 [0051]) or even the electric dipole flipping that produces asymmetrical remnant polarization in the ferroelectric layer {id. at [0058], last sentence). The Examiner makes no findings regarding further limitations recited in claim 1 or the other claims rejected as anticipated, nor any findings regarding limitations in other claims rejected as obvious in view of Oezyilmaz that cure this fundamental defect. We therefore reverse all rejections of record based on Oezyilmaz. C. Order It is ORDERED that the rejection of claims 1-20 is reversed. REVERSED 8 Copy with citationCopy as parenthetical citation