Ex Parte NaikDownload PDFPatent Trial and Appeal BoardFeb 11, 201311639659 (P.T.A.B. Feb. 11, 2013) Copy Citation UNITED STATES PATENT AND TRADEMARK OFFICE ________________ BEFORE THE PATENT TRIAL AND APPEAL BOARD ________________ Ex parte SUJIT NAIK ________________ Appeal 2010-011393 Application 11/639,659 Technology Center 3700 ________________ Before MURRIEL E. CRAWFORD, MEREDITH C. PETRAVICK, and JAMES A. TARTAL, Administrative Patent Judges. TARTAL, Administrative Patent Judge. DECISION ON APPEAL Appeal 2010-011393 Application 11/639,659 2 STATEMENT OF THE CASE1 Sujit Naik (Appellant) seeks our review under 35 U.S.C § 134 of the Examiner’s final decision rejecting claims 1-20 and 61-63. We have jurisdiction over the appeal pursuant to 35 U.S.C. § 6(b). Appellant’s claimed invention relates to polishing liquids for activating and/or conditioning fixed abrasive pads, and associated systems and methods. Spec. [0001]. Claim 1, reproduced below, is illustrative of the subject matter on appeal. 1. A method for using a polishing pad, comprising: disposing a polishing liquid on a polishing surface of a polishing pad, the polishing pad including a matrix material and a plurality of abrasive elements fixedly distributed in the matrix material, the polishing liquid including a plurality of particles that are suspended in the polishing liquid and at least approximately chemically inert with respect to the abrasive elements; contacting the polishing surface of the polishing pad with a semiconductor wafer in the presence of the polishing liquid to remove material from the semiconductor wafer, at least a part of the removed material forming deposits on the abrasive elements of the polishing pad; and moving at least one of the polishing pad and the plurality of particles relative to the other to remove the deposits from the abrasive elements of the polishing pad. The Examiner relies upon the following evidence: James US 6,337,281 Jan. 8, 2002 1 Our decision will make reference to the Appellant’s Appeal Brief (“App. Br.,” filed Jan. 4, 2010) and Reply Brief (“Reply Br.,” filed Jun. 1, 2010), and the Examiner’s Answer (“Ans.,” mailed Apr. 2, 2010). Appeal 2010-011393 Application 11/639,659 3 Claims 1-20 and 61-63 stand rejected under 35 U.S.C. § 102(b) as being anticipated by James. FINDINGS OF FACT We find that the findings of fact which appear in the Analysis below are supported by at least a preponderance of the evidence. Ethicon, Inc. v. Quigg, 849 F.2d 1422, 1427 (Fed. Cir. 1988) (explaining the general evidentiary standard for proceedings before the Office). ANALYSIS Claims 1-13 and 61-63 Independent claim 1 requires “moving at least one of the polishing pad and the plurality of particles [suspended in the polishing liquid] relative to the other to remove the deposits from the abrasive elements of the polishing pad.” Independent claim 61 requires “scrubbing the abrasive elements with the particles in the polishing liquid to remove the deposited material from the abrasive elements of the polishing pad.” We find that the Examiner has not established that James expressly or inherently describes the use of particles in the polishing liquid to remove deposits or deposited material from the abrasive elements of the polishing pad as required by claims 1 and 61. We disagree with the Examiner’s assertion that Examples 2 and 3 of James disclose the limitations. Ans. 3. Example 2 of James does not address a polishing liquid and Example 3 expressly states that “particle-free polishing slurry” was used. James Col. 14, ll. 65 – Col. 15, ll. 38. Accordingly, neither Example 2 nor Example 3 of James discloses the use of particles in the polishing liquid for the purpose of removing deposits from the abrasive elements of the polishing pad. Appeal 2010-011393 Application 11/639,659 4 We further find unsupported the Examiner’s conclusory assertion that claimed features related to the removal of deposits from the abrasive elements in the polishing pad “inherently occur in the art.” Ans. 4. The Examiner has not shown that the missing descriptive material is “necessarily present,” as opposed to merely probably or possibly present in the prior art, and therefore has not established inherent anticipation of the claimed feature. See In re Robertson, 169 F.3d 743, 745 (Fed. Cir. 1999). We therefore reverse the Examiners rejection of claims 1 and 61, as well as the respective associated dependent claims 2-13 and 62 and 63. Claims 14-20 Independent claim 14 requires “moving at least one of the polishing pad and the semiconductor wafer relative to the other to remove material from the semiconductor wafer while simultaneously removing the deposited material from the abrasive elements of the polishing liquid.” Appellant argues that James does not disclose the simultaneous removal of material from the semiconductor wafer and of deposited material from the abrasive elements. App. Br. 14. The Examiner does not directly respond to this argument in the Examiner’s Answer. To the extent the Examiner suggests that such a limitation inherently occurs in the prior art, we again find as discussed above that the Examiner has not demonstrated that the claimed feature is “necessarily present,” and therefore has not established inherent anticipation of the claimed feature. Accordingly, we reverse the Examiners rejection of claim 14, as well as the associated dependent claims 15-20. Appeal 2010-011393 Application 11/639,659 5 CONCLUSIONS OF LAW We conclude that Appellant has overcome the Examiner’s rejection of claims 1-20 and 61-63 under 35 U.S.C. § 102(b) as being anticipated by James. DECISION We REVERSE the decision of the Examiner to reject claims 1-20 and 61-63. REVERSED mls Copy with citationCopy as parenthetical citation