Ex Parte Martinent et alDownload PDFPatent Trial and Appeal BoardSep 26, 201812601125 (P.T.A.B. Sep. 26, 2018) Copy Citation UNITED STA TES p A TENT AND TRADEMARK OFFICE APPLICATION NO. FILING DATE 12/601, 125 04/14/2010 21839 7590 09/28/2018 BUCHANAN, INGERSOLL & ROONEY PC POST OFFICE BOX 1404 ALEXANDRIA, VA 22313-1404 FIRST NAMED INVENTOR Jean-Fran\'.ois Martinent UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www .uspto.gov ATTORNEY DOCKET NO. CONFIRMATION NO. 1032326-000504 5141 EXAMINER KELLY, RAFFERTY D ART UNIT PAPER NUMBER 2876 NOTIFICATION DATE DELIVERY MODE 09/28/2018 ELECTRONIC Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the following e-mail address(es): ADIPDOC 1@BIPC.com PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD Ex parte JEAN-FRANCOIS MARTINENT, 1 Laurence Robles, and Frarn;ois Roussel Appeal 2018-000781 Application 12/601,125 Technology Center 2800 Before MARK NAGUMO, CHRISTOPHER C. KENNEDY, and MERRELL C. CAHION, JR., Administrative Patent Judges. NAGUMO, Administrative Patent Judge. DECISION ON APPEAL Jean-Frarn;ois Martinent, Laurence Robles, and Frarn;ois Roussel ("Martinent") timely appeal under 35 U.S.C. § 134(a) from the Final Rejection2 of all pending claims 1 and 5-18. We have jurisdiction. 35 U.S.C. § 6. We reverse. 1 The real party in interest is identified as Gemalto SA. (Appeal Brief, filed 17 April 2017 ("Br."), 2.) 2 Office Action mailed 23 June 2016 ("Final Rejection"; cited as "FR"). Appeal 2018-000781 Application 12/601, 125 A. Introduction 3 OPINION The subject matter on appeal relates to a light-weight radio frequency transponder antenna (independent claim 10) suitable for, e.g., a contactless chip card, and a method of making such an antenna (independent claim 1.) The '125 Specification explains that a conventional method of making such an antenna involves sewing or embroidering a wire antenna to a textile or fibrous support. (Id. at 2, 11. 8-11.) At the ends of the wire forming the antenna, a number of backing stitches are made to stabilize the structure, "by several passages of the wires or needles at the same place." (Id. at 11. 14-- 16.) This is said to lead to an additional thickness, as well as the presence of an "idle" residual wire, both of which potentially affect adversely the lamination or radio frequency characteristics of the antenna. (Id. at 11. 20- 25.) Moreover, the presence of auxiliary synthetic fibers with the conductive wires is said to lead to deterioration of the soldering tool by pollution from the nonconducting fibers. (Id. at 3, 11. 1-9.) These problems are said to be overcome by arranging the back- stitched end points of the beginning 154 and end 17 of the antenna path in a 3 Application 12/601,125, Method/or producing a device comprising a radio frequency transponder antenna with two terminal sections provided on a support and device thus obtained, filed 14 April 2010 as the national stage under 35 U.S.C. § 371 of PCT/EP2008/056123, filed 19 May 2008, claiming the benefit of an EP application filed 21 May 2007. We refer to the "'125 Specification," which we cite as "Spec." 4 Throughout this Opinion, for clarity, labels to elements are presented in bold font, regardless of their presentation in the original document. 2 Appeal 2018-000781 Application 12/601, 125 region 31' of the insulating substrate 29. (Id. at 3, 1. 23--4, 1. 6; See Figure 6, below left.) Region 31', including the back-stitched wire and any extra "idle wire" 4 is then removed, forming a cavity. (Id. at 4, 11. 8-15; see Figure 7, below right). {Figure 6 (below left) {Figure 6 shows ends 15 and 17 of the antenna wire back-stitched in region 31' of substrate 29} Figure 7 (below right)} {Figure 7 shows region 31' removed, leaving a cavity in substrate 29} {Figure 8 shows an electrical component soldered (26) through contact pads 19, 21 [not labeled] by thermo-compression probe 27 to antenna ends 15, 17} pads 19 and 21 is placed in cavity 31' and soldered to antenna wire ends 15 and 17 by, e.g., thermo-compression probe 27. (Id. at 12, 11. 22-26.) 3 Appeal 2018-000781 Application 12/601, 125 Probe 27 does not contact, and thus is not polluted by any nonconductive fibers present. (Id. at 4, 11. 24--28.) Claim 1 is representative of the process claims and reads: A method for producing a device comprising a radio frequency transponder antenna, said method comprising: producing the antenna with two terminal sections on a surface of an insulating substrate by means of a wiring technique such that the antenna is fixed to the surface of the insulating substrate by the wiring technique; producing an end point on an antenna wire at the end of at least one of said terminal sections, said end point being made in a zone of the insulating substrate and including a conductive portion; and removing said end point, including said conductive portion, by removing the zone of the insulating substrate in which the end point is made, thereby forming a cavity in the surface of the insulating substrate. (Br., Claims App. 1; some indentation, paragraphing, and emphasis added.) Claim 10 is representative of the device claims and reads: A device including a radio frequency transponder antenna, said antenna comprising an antenna wire having two terminal sections and being fixed to a surface of an insulating substrate by a wiring technique, said insulating substrate defining a cavity, wherein at least one of said terminal sections terminates at the edge of the cavity such that an opening defined by the cavity does not face any portion of the antenna wire. (Br., Claims App. 2; some indentation, paragraphing, and emphasis added.) 4 Appeal 2018-000781 Application 12/601, 125 All other claims depend from claim 1 or from claim 10. The Examiner maintains the following grounds of rejection 5, 6: A. Claims 1 and 6-18 stand rejected under 35 U.S.C. § I03(a) in view of the combined teachings of Finn, 7 Morinaga, 8 and Kamogawa. 9 Al. Claim 5 stands rejected under 35 U.S.C. § I03(a) in view of the combined teachings of Finn, Morinaga, Kamogawa, and Deaett. 10 B. Discussion The Board's findings of fact throughout this Opinion are supported by a preponderance of the evidence of record. The basis of the rejections of both the process-of-making claim 1 and the product claim 10 are essentially parallel, and the Examiner does not raise distinct reasons for the unpatentability of the product claims. In the 5 Examiner's Answer mailed 31 August 2017 ("Ans."). 6 Because this application was filed before the 16 March 2013, effective date of the America Invents Act, we refer to the pre-AIA version of the statute. 7 David Finn, Methods and apparatuses to produce inlays with transponders, U.S. Patent Application Publication 2008/019404 Al (2008), based on an application filed 10 March 2008. 8 Yuichi Morinaga et al., Method of manufacturing a carrier member for electronic components, U.S. Patent Application Publication 2006/0283467 Al (2006). 9 Kenji Kamogawa and Tsuneo Tokumitsu, Heterogeneous multi-lamination microstrip antenna, U.S. Patent No. 6,384,785 Bl (2002). 10 Michael A. Deaett and William H. Weedon III, Method for constructing antennas from textile fabrics and components, U.S. Patent Application Publication 2005/0235482 Al (2005). 5 Appeal 2018-000781 Application 12/601, 125 Examiner's words, "[r]egarding claims 10, 11, and 18, see the responses above." (Ans. 8.) Accordingly, we focus our attention on claim 1. Martinent urges the Examiner erred harmfully because there is, in Martinent's view, no basis for combining features of the wire antenna described by Finn, illustrated by Figure 11, below, {Figure 11 shows HF antenna 1116 and chip module 1120 in recess 1126.} with features of the slot antenna disclosed by Morinaga, illustrated in Figure 4 (below left) and Figure 5 (below right). 1b 3a lb 1 I ' ;· 1 '... / \ -.J ( '--+--~---L--~-- .. { .. f ( I ; ~ : : } 1 l l : : :,:1 l : ) : A ' ' ' ' . . ' . ' \ it 2b :\ i f "4a r-,-'.c..,--....,__.....,..........,..._...,, : i ; --<--+-t<-J' ~:-__ -++~---cl----····\ '-"----"-"""-_.:,._.......>.i--i:,,...._-.:,._......p...,__,~.;:,,__~ . 1 \ 3 l 4a 2a Figure 4 shows a plan view of a slot Figure 5 shows a cross section antenna. along A-A. 6 Appeal 2018-000781 Application 12/601, 125 Martinent argues that Morinaga discloses a completely different type of antenna, made in a completely different way, by removing copper from sheet 4 to form slot 4a. Moreover, according to Martinent, removing an antenna portion from the antenna of Finn, which the Examiner finds would have been suggested by Morinaga, "is not possible because the end portions in Finn terminate away from referenced part 1116a or 1116b." (Br. 5, 11. 2- 3.) Review of Finn and Morinaga fully supports Martinent's arguments. Finn describes making the connection between the loops in end portions 1116a and 1116b of the antenna wire 1116 and contact terminal areas 1122 and 1124, in the following words: "[t]he chip can be installed between the loops, into the recess 1126. Then, the loops can be manipulated (re-positioned, drawn in) downwards onto the chip terminals for bonding thereto." (Finn 15 [0298].) As Martinent urges, the Examiner has not shown that a step of "removing said end point, including said conductive portion," as required by claim 1, would serve any purpose disclosed by Finn. Martinent urges further (Br. 5, 1st full para.) that the antenna described by Kamogawa, on which the Examiner relies as evidence of the obviousness of removing a portion of an antenna including a portion of a substrate (FR 4, last two paras., to 5, 1st para.) is yet again a very different type of antenna than the one described by Finn. Martinent explains that in the embodiment illustrated in Figure 7 A (not reproduced here), on which the Examiner relies, "portions of the lamination are removed so that the electronic circuit 20 can be directly mounted to the embedded ground 7 Appeal 2018-000781 Application 12/601, 125 plane 11." (Br. 5, 1st full para.) "However," Martinent continues, "in Finn's Fig. 11 embodiment relied on in the Official Action, the antenna end portions are already directly mounted onto the chip, so it is not clear what the Examiner means in asserting that it would have been obvious to apply the teachings of Kamogawa to 'shorten the length of the wire and the antenna thickness."' (Id.) The weight of the evidence supports Martinent at every point. It may be that the Examiner considers the claims to be far broader than the embodiments described in the '125 Specification. While it is true that in many cases very broad claims may be shown to be prima facie obvious over art very different from examples disclosed in the supporting specification, the teachings of prior art references must still be mutually compatible if the combinations are to be technically sensible. Because the Examiner failed to provide credible evidence and reasonable explanations of why the various teachings would have been combined 11 by a person having ordinary skill in the art, we are persuaded of harmful error in the appealed rejections, and we reverse. C. Order It is ORDERED that the rejection of claims 1 and 5-18 is reversed. REVERSED 11 The Examiner has not made any findings regarding the dependent claims, including separately rejected claim 5, that cure the defects identified supra. 8 Copy with citationCopy as parenthetical citation