Ex Parte LIN et alDownload PDFPatent Trial and Appeal BoardSep 4, 201814205880 (P.T.A.B. Sep. 4, 2018) Copy Citation UNITED STA TES p A TENT AND TRADEMARK OFFICE APPLICATION NO. FILING DATE 14/205,880 03/12/2014 23628 7590 09/06/2018 WOLF GREENFIELD & SACKS, P.C. 600 ATLANTIC A VENUE BOSTON, MA 02210-2206 UNITED ST A TES OF AMERICA FIRST NAMED INVENTOR Tzu-Hung LIN UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www .uspto.gov ATTORNEY DOCKET NO. CONFIRMATION NO. Ml295.70039US04 2749 EXAMINER PIZARRO CRESPO, MARCOS D ART UNIT PAPER NUMBER 2814 NOTIFICATION DATE DELIVERY MODE 09/06/2018 ELECTRONIC Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the following e-mail address(es): Patents_eOfficeAction@WolfGreenfield.com WGS_eOfficeAction@WolfGreenfield.com PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD Ex parte TZU-HUNG LIN, WEN-SUNG HSU, TA-JEN YU, and ANDREW C. CHANG Appeal 2017-011220 Application 14/205,880 Technology Center 2800 Before ROMULO H. DELMENDO, JEFFREY B. ROBERTSON, and DEBRA L. DENNETT, Administrative Patent Judges. DELMENDO, Administrative Patent Judge. DECISION ON APPEAL The Applicant (hereinafter "Appellant") 1 appeals under 35 U.S.C. § 134(a) from the Primary Examiner's final decision to reject claims 1--4, 6, 7, 9--17, and 19--22. 2 We have jurisdiction under 35 U.S.C. § 6(b). We reverse. 1 The Appellant is the Applicant, MediaTek Inc., which, according to the Brief, is the real party in interest (Appeal Brief filed March 30, 2017 (hereinafter "Appeal Br.") 2; Application Data Sheet filed March 12, 2014). 2 Appeal Br. 5-15; Reply Brief filed August 29, 2017 (hereinafter "Reply Br.") 2-5; Final Office Action entered August 30, 2016 (hereinafter "Final Act.") 3-7; Examiner's Answer entered June 30, 2017 (hereinafter "Ans.") 3-13. Appeal 2017-011220 Application 14/205,880 I. BACKGROUND The subject matter on appeal relates to a semiconductor package (Specification filed March 12, 2014 (hereinafter "Spec.") ,r 2). Figure 1 (annotated), which is reproduced below from the Drawings filed March 12, 2014, is illustrative: 230 -·-"" -. 212a. ,-v:-•:::. 1,-1. .• ;,. .. 'f''"" \ .j •OCCis,;c,circ.e. :S.CJOc C(•l>CC••Ot<'>'E< .. ,,Ce (/,.:; 'I· \ ( \ \ / :_;;.}$:...; ~~.~!. pr.::icCopy with citationCopy as parenthetical citation
