Ex Parte HusheerDownload PDFPatent Trial and Appeal BoardJun 24, 201613061191 (P.T.A.B. Jun. 24, 2016) Copy Citation UNITED STA TES p A TENT AND TRADEMARK OFFICE APPLICATION NO. FILING DATE 13/061,191 03/21/2011 20230 7590 06/28/2016 V orys, Sater, Seymour and Pease LLP 1909 K St., NW 9th Floor WASHINGTON, DC 20006-1152 FIRST NAMED INVENTOR Shamus Husheer UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www .uspto.gov ATTORNEY DOCKET NO. CONFIRMATION NO. 073129.000004 4453 EXAMINER TOWA,RENET ART UNIT PAPER NUMBER 3736 NOTIFICATION DATE DELIVERY MODE 06/28/2016 ELECTRONIC Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the following e-mail address( es): patlaw@vorys.com PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD Ex parte SHAMUS HUSHEER Appeal2014-001001 Application 13/061,191 1 Technology Center 3700 Before LINDA E. HORNER, STEFAN STAICOVICI, and JAMES J. MAYBERRY, Administrative Patent Judges. STAICOVICI, Administrative Patent Judge. DECISION ON APPEAL STATEMENT OF THE CASE Shamus Husheer (Appellant) appeals under 35 U.S.C. § 134(a) from the Examiner's final decision rejecting claims 1-3, 5, 6, 8-19, 21, 22, and 24. 2 Appellant's representative presented oral argument on June 21, 2016. We have jurisdiction over this appeal under 35 U.S.C. § 6(b). According to Appellant, the real party in interest is Cambridge Temperature Concepts Limited. Appeal Br. 1 (filed June 6, 2013). 2 Claims 4, 7, 20, and 23 are cancelled. Final Act. 2 (mailed Nov. 26, 2012). Appeal2014-001001 Application 13/061, 191 SUMMARY OF DECISION We REVERSE and ENTER NEW GROUND OF REJECTION PURSUANT TO OUR AUTHORITY UNDER 37 C.F.R. § 41.50(b ). INVENTION Appellant's invention relates to a "device for measuring temperature and heat flow into or out of a subject body." Spec. 5. Claims 1 and 17 are independent. Claim 1 is illustrative of the claimed invention and reads as follows: 1. A device for measuring temperature comprising: first and second temperature sensors enclosed in a first material having one or more material components; a contact surface for contacting a body whose temperature is to be measured; wherein the first and second temperature sensors are arranged at different depths from the contact surface and the net thermal conductivity across the device from the contact surface through the first and second temperature sensors is greater than the net thermal conductivity of the device in lateral directions parallel to the contact surface. REJECTIONS The following rejections are before us for review: I. The Examiner rejected claims 1-3, 5, 6, 8-13, 15, 18, 19, 21, and 24 under 35 U.S.C. § 103(a) as being unpatentable over Sattler (US 2008/0170600 Al, pub. July 17, 2008) and Tsuchida (US 4,929,089, iss. May 29, 1990). II. The Examiner rejected claims 14, 17, and 22 under 35 U.S.C. § 103(a) as being unpatentable over Sattler, Tsuchida, and Heikkila (US 5,816,706, iss. Oct. 6, 1998). 2 Appeal2014-001001 Application 13/061, 191 III. The Examiner rejected claim 16 under 35 U.S.C. § 103(a) as being unpatentable over Sattler, Tsuchida, and Carlton-Foss (US 2007/0295713 Al, pub. Dec. 27, 2007). ANALYSIS Rejection I The Examiner finds that Sattler discloses most of the limitations of independent claim 1 including, inter alia, a temperature measuring device having first and second sensors 2, 3 arranged at different depths from contact surface 9 and enclosed in material 4 having first and second material components 4, 7. See Final Act. 2--4; see also Sattler i-fi-f 19--20; Figs. 1, 2. The Examiner further finds that Sattler fails to disclose that the thermal conductivity across its device in a direction from contact surface 9 towards sensors 2, 3, is greater than the thermal conductivity in a perpendicular direction, i.e., lateral direction. See Final Act. 4. Nonetheless, the Examiner finds that Tsuchida discloses a device 100 having a net thermal conductivity across the device (axial direction) greater than the net thermal conductivity in lateral directions. Id. at 4; Ans. 5 (mailed Aug. 22, 2013); see also Tsuchida, col. 14, 11. 39--48, col. 16, 11. 49-53. The Examiner concludes that it would have been obvious for a person of ordinary skill in the art to substitute Tsuchida's anisotropic material for the material of Sattler's heat flux insulation material because "such a modification would amount to a simple substitution of one known element ... for another ... to obtain predictable results such as making conductivity in the axial direction substantially larger than that in the lateral direction" and thus, "measure the 3 Appeal2014-001001 Application 13/061, 191 internal temperature of an object while minimizing extraneous heat inputs or losses occurring laterally to the main heat flow path from the wearer's skin to the ambient environment." See Final Act. 5; see also Ans. 6 (emphasis omitted). Appellant argues that the Examiner's reasoning to modify Sattler' s device to include an anisotropic material, as taught by Tsuchida, "is found only in the teachings of the presently appealed application." Reply Br. 4; see also Appeal Br. 10, 13. Thus, Appellant appears to argue that the Examiner's reasoning is based on impermissible hindsight. We agree with Appellant for the following reasons. First, we do not agree with the Examiner's position that replacing Sattler's heat flux insulation material 4 in the embodiment of Figure 1 with Tsuchida's spiral enclosure 100 (see Tsuchida, col. 14, 11. 39--50) or anisotropic material (see id., col. 16, 11. 49--53) is a mere substitution of one known element for another because Tsuchida' s spiral enclosure 100 or anisotropic material, that transfer heat flux differently in different directions, will not transfer heat flux in the same manner as Sattler' s homogeneous material that provides uniform heat flux transfer (see Sattler i-f 19). Secondly, we note that the Examiner's reasoning appears to already be adequately performed by Sattler's device. Specifically, Sattler discloses reducing lateral heat flux transfer when measuring the core temperature of a patient by either reducing the lateral dimension of heat flux insulation block 4 in the middle section 7 (as per the embodiment of Figure 2) or by providing an additional lateral heat flux insulation block 8 (as per the embodiment of Figure 3). See also Sattler i-fi-112, 20, 21. The Examiner has 4 Appeal2014-001001 Application 13/061, 191 not provided any findings that Sattler recognized a problem with the methods described above to reduce lateral heat flux transfer. Without a persuasive articulated rationale based on rational underpinnings for modifying the reference as proposed, the Examiner's rejection appears to be the result of hindsight analysis. See In re Kahn, 441 F.3d 977, 988 (Fed. Cir. 2006). Accordingly, for the foregoing reasons, we do not sustain the rejection under 35 U.S.C. § 103(a) of claims 1-3, 5, 6, 8-13, 15, 18, 19, 21, and 24 as being unpatentable over Sattler and Tsuchida. Rejections II and III With respect to these rejections, the Examiner's use of the disclosures of Heikkila and Carlton-Foss do not remedy the deficiencies of Sattler and Tsuchida as described supra. See Final Act. 6-8. Accordingly, for the same reasons as discussed above, we also do not sustain the rejections under 35 U.S.C. § 103(a) of claims 14, 17, and 22 as unpatentable over Sattler, Tsuchida, and Heikkila and of claim 16 as unpatentable over Sattler, Tsuchida, and Carlton-Foss. NEW GROUND OF REJECTION We make the following new ground of rejection pursuant to 37 C.F.R. § 41.50(b). Claims 1, 2, 5, 8, 10-13, 15, 18, 21, and 24 are rejected under 35 U.S.C. § 103(a) as unpatentable over Sattler and Stivoric (US 6,595,929 B2, iss. July 22, 2003). 5 Appeal2014-001001 Application 13/061, 191 Sattler discloses a temperature measuring device for measuring the core temperature of a patient having first and second sensors 2, 3 arranged at different depths from contact surface 9 and enclosed in a material 4. See Sattler i-f 19; Fig. 1. Sattler further discloses the use of lateral heat flux insulation block 8 to reduce lateral heat flux and provide lateral temperature insulation. See id. i-f 21; Fig. 3. Sattler fails to disclose an anisotropic material having a thermal conductivity in a direction from contact surface 9 towards sensors 2, 3, greater than the thermal conductivity in a perpendicular direction, i.e., lateral directions. Stivoric discloses a device 680C for measuring heat flux between a wearer's skin 695 and an ambient environment 702 using a heat flux sensor 460. Stivoric, Abstract; col. 27, 11. 17-26; Fig. 21 C. Stivoric further discloses "minimiz[ing] extraneous heat inputs or losses occurring laterally to the main heat flow path (emphasis added)" by either insulating the device "from laterally contacting heat sources or heat sinks" (lateral heat flux insulation similar to Sattler) or by making the device from a "thermally anisotropic material which has a thermal conductivity in the direction of the main heat flow path that is substantially higher than its thermal conductivity perpendicular to that direction." Id. at col. 29, 11. 46-57. As such, it would have been obvious for a person of ordinary skill in the art to provide an anisotropic material, as taught by Stivoric, as Sattler' s material 4 embedding sensors 2, 3, because Stivoric discloses that the use of an anisotropic material is a known equivalent alternative to providing lateral heat flux insulation. Hence, the anisotropic material in the temperature measuring 6 Appeal2014-001001 Application 13/061, 191 device of Sattler, as modified by Stivoric, will have a low thermal conductivity in a direction from contact surface 9 towards sensors 2, 3 (such as 0.05 to 0.3 W/mK, as taught by Sattler) and a much lower thermal conductivity in a perpendicular direction, i.e., lateral directions, as taught by Stivoric. See Sattler i-fi-f l 0, 19. With respect to claims 2 and 18, as Stivoric discloses an anisotropic material, the material of Sattler's device, as modified by Stivoric, exhibits an anisotropic thermal conductivity, wherein the thermal conductivity is lowest in lateral directions. See Stivoric, col. 29, 11. 46-57. In regards to claims 5, 8, 10, and 11, Sattler discloses embedding disc- shaped material 4 (first material component) within a ring-shaped annular lateral heat flux insulation block 8 (second material component) of a different material, to reduce lateral heat flow. See id. i121; Fig. 3. Therefore, it would have been obvious for a person of ordinary skill in the art to provide a ring-shaped lateral insulation block to the disc-shaped anisotropic material of Sattler' s device, as modified by Stivoric, in order to provide additional lateral temperature insulation and thus further reduce lateral heat flow. This in tum, further reduces the heat transfer coefficient between sensors 2, 3 and thus provides measurements that are more precise. See Sattler i1i18, 9, 20. As the material of the ring-shaped insulation block provides additional lateral temperature insulation, it would have been obvious for a person of ordinary skill in the art to choose a material that has a thermal conductivity lower than the thermal conductivity in the lateral 7 Appeal2014-001001 Application 13/061, 191 directions of the anisotropic material of Sattler's device, as modified by Stivoric. 3 As to claims 12 and 13, sensors 2, 3 of Sattler's device, as modified by Stivoric, are located at different distances, i.e., thermal depth, from contact surface 9. See Sattler, Fig. 1. With respect to claims 15, 21, and 24, as Sattler discloses material 4 having a bottom contact surface 9, a top outer surface exposed to the ambient, and a thermal conductivity of 0.05 to 0.3 W/mK, respectively, the modified device of Sattler, according to Stivoric, will likewise disclose these features. See Sattler i-fi-f l 0, 19; Fig. 1. With respect to claims 3, 6, 9, 14, 16, 17, 19, and 22, although we decline to reject every claim under our discretionary authority under 37 C.F .R. § 41.50(b ), we emphasize that our decision does not mean the remaining claims are patentable. Rather, we merely leave the patentability determination of these claims to the Examiner. See MPEP § 1213.02. SUMMARY The Examiner's decision to reject claims 1-3, 5, 6, 8-19, 21, 22, and 24 is reversed. 3 It is well known in the art of heat transfer that in order to have low heat flow through a material, the material should possess a low thermal conductivity. An artisan must be presumed to know something about the art apart from what the references disclose. See In re Jacoby, 309 F.2d 513, 516 (CCPA 1962). 8 Appeal2014-001001 Application 13/061, 191 We enter a new ground of rejection of claims 1, 2, 5, 8, 10-13, 15, 18, 21, and 24 under 35 U.S.C. § 103(a) as unpatentable over Sattler and Stivoric. This decision contains a new ground of rejection pursuant to 37 C.F.R. § 41.50(b). 37 C.F.R. § 41.50(b) provides "[a] new ground of rejection pursuant to this paragraph shall not be considered final for judicial review." 37 C.F.R. § 41.50(b) also provides: When the Board enters such a non-final decision, the appellant, within two months from the date of the decision, must exercise one of the following two options with respect to the new ground of rejection to avoid termination of the appeal as to the rejected claims: (1) Reopen prosecution. Submit an appropriate amendment of the claims so rejected or new Evidence relating to the claims so rejected, or both, and have the matter reconsidered by the Examiner, in \vhich event the prosecution \Vill be remanded to the Examiner. The new ground of rejection is binding upon the examiner unless an amendment or new Evidence not previously of Record is made which, in the opinion of the examiner, overcomes the new ground of rejection designated in the decision. Should the examiner reject the claims, appellant may again appeal to the Board pursuant to this subpart. (2) Request rehearing. Request that the proceeding be reheard under§ 41.52 by the Board upon the same Record. The request for rehearing must address any new ground of rejection and state with particularity the points believed to have been misapprehended or overlooked in entering the new ground of rejection and also state all other grounds upon which rehearing is sought. 9 Appeal2014-001001 Application 13/061, 191 Further guidance on responding to a new ground of rejection can be found in the Manual of Patent Examining Procedure§ 1214.01. REVERSED; 37 C.F.R. § 41.50(b) 10 Copy with citationCopy as parenthetical citation